Xilence ZUB-XPTP.X5 heat sink compound

Xilence ZUB-XPTP.X5. Thermal conductivity: 5.15 W/m·K, Product colour: Black, Red, White, Viscosity note: 73 CPS. Weight: 3 g. Quantity per pack: 1 pc(s), Package width: 120 mm, Package depth: 20 mm
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C - therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.

Features

Thermal conductivity: 5.15 W/m·K
Product colour: Black, Red, White
Viscosity note: 73 CPS
Thermal resistance: 0.201 °C/W
Operating temperature (T-T): -30 - 280 °C
Certification: CE

Technical details

Compliance certificates: RoHS

Weight dimensions

Weight: 3 g

Packaging data

Quantity per pack: 1 pc(s)
Package width: 120 mm
Package depth: 20 mm
Package height: 10 mm