Xilence XZ018 / ZUB-XPTP heat sink compound
Product reference:
29-4044953501067
Xilence XZ018 / ZUB-XPTP, Thermal paste, 5.15 W/m·K, Black, White, 0.201 °C/W, -30 - 280 °C, 110 mm
Xilence XZ018 / ZUB-XPTP heat sink compound
Product reference:
29-4044953501067
Xilence XZ018 / ZUB-XPTP, Thermal paste, 5.15 W/m·K, Black, White, 0.201 °C/W, -30 - 280 °C, 110 mm
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Guarantee
24 month
Delivery from Europe in
5 - 10
business days
Not available
Xilence XZ018 / ZUB-XPTP. Type: Thermal paste, Thermal conductivity: 5.15 W/m·K, Product colour: Black, White. Width: 110 mm, Depth: 25 mm, Height: 15 mm. Quantity per pack: 1 pc(s), Package type: Blister
The Xilence Thermal Paste has a high thermal conductivity guarantees an efficient heat exchange and low temperatures. The paste works reliably at temperatures from -30 to +280°C
Features
Type: Thermal paste
Thermal conductivity: 5.15 W/m·K
Product colour: Black, White
Thermal resistance: 0.201 °C/W
Operating temperature (T-T): -30 - 280 °C
Weight dimensions
Width: 110 mm
Depth: 25 mm
Height: 15 mm
Weight: 1.5 g
Packaging data
Quantity per pack: 1 pc(s)
Package type: Blister
| Manufacturer code | XPTP |
| Weight | 0 kg |
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