ENDORFY Pactum 4 heat sink compound
Product reference:
29-5903018666358
ENDORFY Pactum 4, Thermal paste, 12 W/m·K, 2.6 g/cm³, 1.5 g, 1 pc(s), Blister
ENDORFY Pactum 4 heat sink compound
Product reference:
29-5903018666358
ENDORFY Pactum 4, Thermal paste, 12 W/m·K, 2.6 g/cm³, 1.5 g, 1 pc(s), Blister
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Guarantee
24 month
Delivery from Europe in
6 - 11
business days
Not available
ENDORFY Pactum 4. Type: Thermal paste, Thermal conductivity: 12 W/m·K, Specific gravity: 2.6 g/cm³. Weight: 1.5 g. Quantity per pack: 1 pc(s), Package type: Blister
Pact 4 1.5 g
Thermal paste Pactum 4 1.5 g is like AC on a hot night - when applied pleasantly cools the warmed up components.
You can put it on in seconds. You only need to thinly spread the paste on the surface of the processor with the included spatula and that's it. You can install cooler now.
Features
Type: Thermal paste
Thermal conductivity: 12 W/m·K
Specific gravity: 2.6 g/cm³
Weight dimensions
Weight: 1.5 g
Packaging data
Quantity per pack: 1 pc(s)
Package type: Blister
| Manufacturer code | EY0C003 |
| Product condition | - New / demo item - 12 months warranty - With accessories |
| Product packaging | - The packaging is damaged or unopened |
| Weight | 0.01 kg |
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