Cooler Master CryoFuze heat sink compound

Cooler Master CryoFuze. Type: Thermal paste, Thermal conductivity: 14 W/m·K, Product colour: Grey. Volume: 0.7 ml, Weight: 2 g. Quantity per pack: 1 pc(s), Package width: 113 mm, Package depth: 163 mm. Master (outer) case width: 345 mm, Master (outer) case length: 360 mm, Master (outer) case height: 256 mm
Close Cold Contact
Thermal Grease CryoFuze
Cooler Master is launching CryoFuze, the all new line of thermal paste delivering superior bonding for your processing capabilities.
High Performance
Utilizing nanoparticles, CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer.
Exceptional Thermal
K value of 14W/mK handles even the most extreme system builds.
Non-Corrosive Formula
The non corrosive and oxidation resistant properties prevent solidification and leaves metal contact surfaces unharmed. CryoFuze has a versatile range of temperature performance, maintaining stability from -50°C up to 250°C.
Easy Application
Viscously balanced formula allow for easy application and clean up.

Features

Type: Thermal paste
Thermal conductivity: 14 W/m·K
Product colour: Grey
Specific gravity: 2.6 g/cm³
Operating temperature (T-T): -50 - 250 °C

Weight dimensions

Volume: 0.7 ml
Weight: 2 g

Packaging data

Quantity per pack: 1 pc(s)
Package width: 113 mm
Package depth: 163 mm
Package height: 33 mm
Package weight: 35 g

Logistics data

Master (outer) case width: 345 mm
Master (outer) case length: 360 mm
Master (outer) case height: 256 mm
Products per master (outer) case: 40 pc(s)