Aerocool COG4 heat sink compound
Product reference:
29-4710562755503
Aerocool COG4, Thermal paste, 8.5 W/m·K, Carbon, Metal oxide, Silicone, 1000 poise, 3.25 g/cm³, -30 - 280 °C
Aerocool COG4 heat sink compound
Product reference:
29-4710562755503
Aerocool COG4, Thermal paste, 8.5 W/m·K, Carbon, Metal oxide, Silicone, 1000 poise, 3.25 g/cm³, -30 - 280 °C
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Guarantee
24 month
Delivery from Europe in
5 - 10
business days
Aerocool COG4. Type: Thermal paste, Thermal conductivity: 8.5 W/m·K, Constitutive ingredients: Carbon, Metal oxide, Silicone. Weight: 4 g. Quantity per pack: 1 pc(s)
High-performance thermal paste specially designed for overclocking or gaming PCs. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, this thermal paste is completely safe to use. Comes with a spreader for quick and easy application.
Features
Type: Thermal paste
Thermal conductivity: 8.5 W/m·K
Constitutive ingredients: Carbon, Metal oxide, Silicone
Viscosity note: 1000 poise
Specific gravity: 3.25 g/cm³
Operating temperature (T-T): -30 - 280 °C
Weight dimensions
Weight: 4 g
Packaging data
Quantity per pack: 1 pc(s)
| Manufacturer code | ACTG-NA64210.01 |
| Weight | 0 kg |
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