StarTech.com HEATGREASE20 heat sink compound

StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks. Thermal conductivity: 1.066 W/m·K, Product colour: White, Thermal resistance: 0.195 °C/W. Width: 72 mm, Depth: 18 mm, Height: 18 mm. Package width: 79 mm, Package depth: 147 mm, Package height: 21 mm. Master (outer) case width: 434 mm, Master (outer) case length: 345 mm, Master (outer) case height: 349 mm

Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound

The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.

This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.

Please see our support section for the Material Safety Data Sheet for HEATGREASE20.

Features

Thermal conductivity: 1.066 W/m·K
Product colour: White
Thermal resistance: 0.195 °C/W
Specific gravity: 2.3 g/cm³
Operating temperature (T-T): -20 - 100 °C
Storage temperature (T-T): -50 - 100 °C
Operating relative humidity (H-H): 10 - 80%

Technical details

Evaporation (@ 200°C/24h): 0.001%
Bleed (@ 200°C/24h): 0.005%
Compliance certificates: RoHS

Weight & dimensions

Width: 72 mm
Depth: 18 mm
Height: 18 mm
Weight: 24 g

Packaging data

Package width: 79 mm
Package depth: 147 mm
Package height: 21 mm
Package weight: 37 g

Logistics data

Master (outer) case width: 434 mm
Master (outer) case length: 345 mm
Master (outer) case height: 349 mm
Products per master (outer) case: 230 pc(s)