DeLOCK 18474 heat sink compound
Product reference:
29-4043619184743
DeLOCK 18474, Thermal pad, 3 W/m·K, Grey, -60 - 180 °C, 20 mm, 70 mm
DeLOCK 18474 heat sink compound
Product reference:
29-4043619184743
DeLOCK 18474, Thermal pad, 3 W/m·K, Grey, -60 - 180 °C, 20 mm, 70 mm
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Guarantee
24 month
Delivery from Europe in
5 - 10
business days
Not available
DeLOCK 18474. Type: Thermal pad, Thermal conductivity: 3 W/m·K, Product colour: Grey. Width: 20 mm, Depth: 70 mm, Height: 1.75 mm. Quantity per pack: 1 pc(s), Package type: Polybag. Country of origin: China, Taiwan
This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components.
Features
Type: Thermal pad
Thermal conductivity: 3 W/m·K
Product colour: Grey
Operating temperature (T-T): -60 - 180 °C
Weight & dimensions
Width: 20 mm
Depth: 70 mm
Height: 1.75 mm
Packaging data
Quantity per pack: 1 pc(s)
Package type: Polybag
Logistics data
Country of origin: China, Taiwan
| Gamintojo kodas | 18474 |
| Weight | 0.01 kg |
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