DeLOCK 18470 heat sink compound
Product reference: 29-4043619184705

DeLOCK 18470, Thermal pad, 3.2 W/m·K, Grey, -60 - 180 °C, 20 mm, 120 mm

DeLOCK 18470 heat sink compound

Product reference: 29-4043619184705

DeLOCK 18470, Thermal pad, 3.2 W/m·K, Grey, -60 - 180 °C, 20 mm, 120 mm

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Guarantee
24 month

Delivery from Europe in
5 - 10
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DeLOCK 18470. Type: Thermal pad, Thermal conductivity: 3.2 W/m·K, Product colour: Grey. Width: 20 mm, Depth: 120 mm, Height: 2 mm. Quantity per pack: 1 pc(s), Package type: Polybag. Country of origin: China, Taiwan
This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components.
Low oil bleeding
This pad releases very little oil, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with 'low oil bleeding' retain their thermal and mechanical properties better and thus ensure even and stable heat dissipation.

Features

Type: Thermal pad
Thermal conductivity: 3.2 W/m·K
Product colour: Grey
Operating temperature (T-T): -60 - 180 °C

Weight dimensions

Width: 20 mm
Depth: 120 mm
Height: 2 mm

Packaging data

Quantity per pack: 1 pc(s)
Package type: Polybag

Logistics data

Country of origin: China, Taiwan


Manufacturer code18470
Weight0 kg
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