Bambu Engineering Panel H2S
Product reference: 14-6937285510402

Bamboo Engineering Plate for H2S is a high-temperature, high-adhesion surface for engineering materials such as ABS, ASA, PC, nylon and carbon fiber composites. The reinforced composite structure provides excellent thermal stability, strong adhesion and reliable performance for complex prints. Ideal for professional applications that require durability, precision and consistent results.

Bambu Engineering Plokštė H2S
Bambu Engineering Plokštė H2S
Bambu Engineering Plokštė H2S
Bambu Engineering Plokštė H2S

Bambu Engineering Panel H2S

Product reference: 14-6937285510402

Bamboo Engineering Plate for H2S is a high-temperature, high-adhesion surface for engineering materials such as ABS, ASA, PC, nylon and carbon fiber composites. The reinforced composite structure provides excellent thermal stability, strong adhesion and reliable performance for complex prints. Ideal for professional applications that require durability, precision and consistent results.

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77,63 €
Last product in warehouse

Guarantee
24 month

Delivery from Lithuania in
2 - 3
business days

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Bamboo engineered board - Specifications


Product name: Bamboo engineered board Compatibility: Bambu Lab H2S / H2 series Plate type: High temperature engineering construction surface


Technical specifications




  • Material type: High Temperature Engineering Composite




  • Surface finish: Smooth, high-grip engineered surface




  • Board structure: Two-layer composite with reinforced core




  • Magnetic base: Yes (integrated steel plate for magnetic mounting)




  • Flexibility: Semi-flexible for easy removal of prints




  • Deformation resistance: High resistance to thermal deformation




  • Heat tolerance: Designed for high temperature materials




Supported materials


Optimized for engineering grade filaments:




  • ABS




  • ASA




  • PC




  • PA (Nylon)




  • PA-CF




  • PET-CF




  • High temperature composites




  • Other engineering materials requiring strong adhesion to the surface




Note: PLA or TPU is not recommended due to excessive adhesion.


Recommended print settings




  • Surface temperature: 90-110°C (depends on the material)




  • Spray temperature: Up to 300°C (H2S hothead capacity)




  • Cooling: Reduced part cooling for high temperature materials




  • Traction aid: Not required; the plate provides strong natural adhesion




Dimensions and weight




  • Plate size: 256 × 256 mm




  • Thickness: ~2mm




  • Weight: ~300g




  • Edge design: Rounded corners for safe use




Main features




  • High-adhesion surface for engineering materials




  • Excellent thermal stability




  • Durable composite construction




  • Easy to remove prints, kai plate is flexible




  • Magnetic quick-change design




  • Compatible with Bambu Lab H2S printers and AMS workflows




Included in the package




  • Bamboo engineered board




  • Protective storage bag




  • Quick Start Guide




Height10 mm
Length270mm
Weight400g
Width270mm
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