„Kingston Technology FURY Impact“ atminties modulis

Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact. Component for: Laptop, Internal memory: 16 GB, Memory layout (modules x size): 2 x 8 GB, Internal memory type: DDR5, Memory form factor: 262-pin SO-DIMM, CAS latency: 38

Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play* enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.

Mighty DDR5 SODIMM performance
With a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.

Plug N Play automatic overclocking functionality*
Kingston FURY Impact DDR5's PnP modules automatically overclock to the highest listed speed.

Intel® XMP 3.0 Certified
Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.

Low Power Consumption, Increased efficiency
Keep your system cool and efficient with Kingston FURY Impact DDR5's low power draw.

Improved stability with on-die ECC
Maintain data integrity while hitting overclocking speeds.

Features

Feature: On-Die ECC
CAS latency: 38
Internal memory: 16 GB
Memory layout (modules x size): 2 x 8 GB
Internal memory type: DDR5
Memory data transfer rate: 4800 MT/s
Component for: Laptop
Memory form factor: 262-pin SO-DIMM
Buffered memory type: Unregistered (unbuffered)
Memory ranking: 1
Memory voltage: 1.1 V
Module configuration: 1024M x 64
Row cycle time: 48 ns
Refresh row cycle time: 295 ns
Row active time: 29.12 ns
Feature: Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version: 3.0
Feature: SPD profile
Programming power voltage (VPP): 1.8 V
Cooling type: Heatsink
Lead plating: Gold
Feature: JEDEC standard

Operational conditions

Operating temperature (T-T): 0 - 85 °C
Storage temperature (T-T): -55 - 100 °C

Weight & dimensions

Width: 3.8 mm
Depth: 69.6 mm
Height: 30 mm
Weight: 16 g

Packaging data

Package width: 95.2 mm
Package depth: 14 mm
Package height: 171.4 mm
Package weight: 46.21 g

Logistics data

Harmonized System (HS) code: 84733020
Products per master (outer) case: 25 pc(s)
Master (outer) case width: 203.2 mm
Master (outer) case length: 311.1 mm
Master (outer) case height: 101.6 mm
Master (outer) case gross weight: 1.37 kg

Other features

Country of origin: China, Taiwan